OVERVIEW
HSPTEK’s team of engineers has deep expertise with many years of experience in hardware design. Help customers optimize the process of creating solutions, designing schematics, designing PCBs, simulating signals, thereby shortening development time and optimizing product costs.
CAPACITY
Solution
HSPTEK provides solutions from the world’s leading chipset manufacturers such as Qualcomm, Mediatek, NXP, TI, Microchip, Rockchip, Realtek, Renesas… for a variety of product lines in fields such as Mobility, AIOT, Automotive, and Industry. Karma…
Schematic design
Our engineers perform Schematic Design and ensure that customers get high interoperability and design data integrity.
Low power design
We have extensive experience in low-power design to ensure lower power consumption and efficient battery management for IoT devices by implementing power management as well as system optimization.
PCB design
The team of engineers has many years of experience designing PCBs for products such as Smartphones based on Qualcomm chips, Smarthomes, Cameras, Headphones, and other IOT devices. Supports designs from simple to complex circuits: FPCB: PTH, HDI from 2 to 4 layers PCB : PTH, HDI from 1 to 16 layers or higher In addition, it supports high-speed layout design such as: USB 2.0/3.0, MIPI CSI, MIPI DSI, DDR2 to DDR4, SD card 3.0/3.1, SGMII, RGMI, MDI 1 Gbps, SFP+10Gbps, PCIe 10Gbps, IFC…..
Signal simulation
During the pre-production design process we will use tools such as Hyperlynx, ADS and Allegro Sigrity to perform the following simulations:
- Heat simulation
- PDN
- High speed signal
- DDR2/DDR3/DDR4